Products > Tungsten, Molybdenum, Ceramics, Composite alloy products > Thermal management materials [ Invader (Si-SiC) ] [ Aluminum Nitride Ceramics (AIN) ] [ Sintered Aluminum-Silicon Carbide (Sintered Al-SiC) ] [ Copper-Buster (Al-SiC) ] [ Copper-Tungsten Alloys (Cu-W) ] [ Copper-Molybdenum Alloys for Heat Sinks ] [ Circular Square Tungsten, Molybdenum Plates ] [ DMCH Diamond Heat Sinks ] Features Material with the same low coefficient of thermal expansion and high thermal conductivity as Silicon Applications LSIs for supercomputers, Heat Sinks (Heatspreaders) of MPUs for high-end servers page top Features Ceramic material with a low coefficient of thermal expansion along with high electrical insulation and low electrical constant Applications Submounts for LEDs and LDs, Heat Sinks (Heatspreaders) of substrates for power transistor page top Features Applicable to small and relatively complex shapes and lightweight with one third of copper density Applications Heat Sinks (Heatspreaders) of MPUs, DSPs Router LSIs, etc. page top Features Thin and inexpensive Aluminum-Silicon Carbide(Al-SiC) Applications Heat Sinks (Heatspreaders) of System LSIs, etc page top Features Alloys with low thermal expansion of tungsten and high thermal conductivity of copper Applications Heat Sinks (Heatspreaders) of Microwave Applications, Opto Electronics, and MPUs, etc. page top Features Alloys with high thermal conductivity and thermal expansion adjustable to suit peripheral materials (applicable to many types of processing) Applications Microwave Applications, Plastic Package, Substrates for power transistors, etc. page top Features Products utilizing low coefficient of thermal expansion similar to silicon's Applications Base Metal for Silicon-controlled Rectifiers page top Features Heat Sinks (Heatspreaders) with high thermal conductivity surpassing all metal ones Applications Submounts for LEDs, High-power Devices page top