Diamond Tools and cBN Tools

Cutting Tools

Nano-Polycrystalline Diamond
Ultra-Precision Cutting Tool BL-UPC

Employs SumiDIA Binderless for the cutting edge of UPC
Realize tool life improvement of mirror finishing and nano-/micro-cutting of cemented carbide

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Ultra-Precision Cutting Tool  BL-UPC

Features of SUMIDIA Binderless
  1. ・Fine grains of several tens of nanometers are firmly and directly bonded together.
  2. ・Harder than single-crystal diamond.
  3. ・No anisotropy and specific cleavage.

Features of BL-UPC
  1. ・Superior chipping and wear resistance to single-/polycrystalline diamond.
  2. ・Sharp cutting edge equivalent to UPC (single-cystal diamond)
  3. ・Free from uneven wear caused by crystal orientation due to no anisotropy.

Usage

・Molding for cemented carbide glass lenses
・Large molding for prism sheet or light guide plate (LGP)
・Glass Lenses
・High-hardness and brittle materials

Technical Data
Surface roughness of cemented carbide
Surface roughness of cemented carbide

Sharp cutting edge equivalent to single-cystal diamond
Sharp cutting edge equivalent to single-cystal diamond

Flank wear comparison after cutting Cemented Carbide
Flank wear comparison after cutting Cemented Carbide

Characteristic comparison of cutting tool matrials
Required

characteristics
diamond
Single crystal Polycrystalline Nano-polycrystalline
1.High hardness
2.High temperature hardness
3.Suitable toughness ×
4.High thermal diffusibility
5.Sharpness of cutting edge ×

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