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2015.12.21 “SEMICON JAPAN 2015″ had finished successfully. Thank you for visiting the booth of A.L.M.T. Corp.

“NANO WORLD INNOVATOR, Future Manufacturing brought by high precision processing.”
We present suggestions to process applications under this concept.
We exhibit “Diamond Wheels realizing high precision and low-damage process
for the next generation wafer of Si, Sapphire, SiC, and LT-circuit board”,
“Precision Diamond Wire Saw contributing to high efficiency and clean processing”,
and “Ultra Precision Diamond Cutting Tools for MEMS”.
 
We also introduce Customer Solution Center offering solutions for customer needs.
 
 

SEMICON Japan 2015
• Date : December 16 (Wed) – December 18 (Fri), 2015
• Venue : Tokyo Big Sight, Tokyo , Japan
• Stand : Hall East 2 2037
 

• Major Exhibits
“Grinding Wheels”
   Grinding wheels for SiC, LT, Silicon, and CMP pad conditioners

“Cutting and Tools”
   Ultra Precision Diamond Cutting tools for MEMS (BL-UPC, BL-PCD)

“Slicing Tools”
   Sapphire, Precision Diamond Wire Saw for Solar battery processing (PWS-E, PWS-R)

“Other accessories”
   Diamond drawing Dies for bonding wire
   Heatspreader Materials
 
 
Please refer further detailed information with regards to the exhibition to

 http://www.semiconjapan.org/en/