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2011.11.18 We will appear at “SEMICON JAPAN 2011″

We will appear again at “ SEMICON JAPAN 2011 ” to be held in Makuhari, Japan from Wednesday December 7 to Friday 9, 2011.


“SEMICON Japan 2011″ is one of the biggest international exhibitions of semiconductor equipment and materials. All the related products would be exhibited by varieties of Exhibitors of some 1,000 companies.

“A.L.M.T.Corp.” is the leading company of diamond precision tools. Our catch phrase is. “Create the future of Cutting, Grinding and Polishing with Precise and Ecological tools”.
We would exhibit many kinds of diamond high performance cutting and grinding tools.

Taking this opportunity, you are cordially invited to visit our booth and use as a space to exchange information and to find out the turn-key solution for your further development.

 

SEMICON Japan 2011
•  Date : December 7 (Wed) – December 9 (Fri), 2011
•  Venue : Makuhari Messe, Chiba, Japan
•  Stand : Hall 4  4A-701
•  Major Exhibits
“Grinding Wheels”
Double disc grinding diamond tools for Si wafer
Diamond wheel for back side grinding to thin thickness wafer for LSI devices
Ultrafine grain diamond wheel for Si wafer
Diamond grinding wheel for sapphire,SiC 

“Cutting and Slicing Tools”
Ultra precision Diamond cutting tools (UPC).
Precision Wire Saw diamond abrasive bonded by electro-plated (PWS-E)
Precision Wire Saw diamond abrasive bonded by resin (PWS-R)

“Other accessories”
Various grinded and polished works (Si, SiC, Sapphire MEMS wafer etc)

 

 

Please refer further detailed information with regards to the exhibition to
http://www.semiconjapan.org/en/index.htm