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Alloy (Cu-W, Cu-Mo)

Cu-W

Cu-W

Cu-W is a combination of W which has low thermal expansion, and Cu which has high thermal conductivity. Thermal expansion can be adjusted to those of Alumina and Kovar materials.
Also, with good machinability, it’s possible to manufacture the parts with small-complicated shapes.
We offer 6 types of CuW (W-6, W-10, W-15, W-20, W-10N, W-10T) according to customer needs.

Application Opto electronics, wireless communication, LED substrate.

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Material Trade Name Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 800℃
Thermal conductivity
[W/ (m・K)]
R.T.
Cu-W W-6 94W-6Cu CuW with its thermal expansion coefficient kept low, having close thermal expansion coefficient to GaAs and GaN, and preventing thermal expansion mismatch. 6.4 141
W-10 89W-11Cu The same thermal expansion coefficient as that of aluminum ceramic, widely used for ceramics package using alumina. 7.9 174
W-15 85W-15Cu The same thermal expansion coefficient as that of beryllia ceramics, widely used for ceramics package using beryllia. It is also widely used for packages using both alumina and kovar because its thermal expansion coefficient is an intermediate value between those of alumina and kovar. 8.6 184
W-20 80W-20Cu Has the same thermal expansion coefficient as that of Kovar, widely used for metal package using Kovar. 9.8 200
W-10N 89W-11Cu Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. If you can prepare specialized molds for W-10N, we can offer outer circumference machining-less CuW (near net CuW), which is cost-effective during mass production. 7.9 200
W-10T 94W-11Cu Although it has the same thermal expansion coefficient as that of W - 10, the thermal conductivity is improved by a special manufacturing method; moreover, it is widely used for sub-mount applications for high power lasers because it can keep warp small. 7.9 205

Cu-Mo

Cu-Mo

Cu-Mo is suitable for rolling and stamping processes. Thermal expansion and thermal conductivity are adjustable with this material. In addition, it has excellent initial heat radiation effect on the surface because the surface of the laminated material CPC is pure Cu.
We offer 10 types of CuMo (CM-15, PCM30, PCM35, PCM40, RCM60, CPC141, CPC232, CPC111, CPC212, CPC-300) according to customer needs.

Application Wireless communication, Opto electronics, in-vehicle, wind power generation, LED, industrial machine

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Material Trade Name Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 800℃
Thermal conductivity
[W/ (m・K)]
R.T.
Cu-Mo CM-15 85Mo-15Cu CuMo with its thermal expansion coefficient kept low, having thermal expansion coefficient close to those of GaAs and GaN, and preventing thermal expansion mismatch. 7.6 148
PCM30 70Mo-30Cu CuMo keeping thermal expansion low, but it can be applied to cost-effective manufacturing methods such as rolling and stamping. 7.5 195
PCM35 65Mo-35Cu Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. 7.8 210
PCM40 60Mo-40Cu As its thermal expansion coefficient is an intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material when devices are mounted on a copper plate or aluminum plate. 8.2 220
RCM60 40Mo-60Cu As its thermal expansion coefficient is an intermediate value between the devices (Si, GaAs, GaN, SiC) and copper or aluminum, it is widely used as a stress cushioning material when devices are mounted on a copper plate or aluminum plate. 10.5 275
CPC141 Cu/PCM/Cu Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. As the surface is copper with high thermal conductivity, it has excellent heat diffusion. 7.6 200
CPC232 Cu/PCM/Cu A material selected because of ideal values in terms of high thermal conductivity and low thermal expansion coefficient. 8.4 235
CPC111 Cu/PCM/Cu A material selected because of ideal values in terms of high thermal conductivity and low thermal expansion coefficient. 9.8 260
CPC212 Cu/PCM/Cu Although it has the same thermal expansion coefficient as that of W - 10, the thermal conductivity is improved by a special manufacturing method; moreover, it is widely used for sub-mount applications for high power lasers because it can keep warp small. 12.1 300
CPC-300 Cu/PCM/Cu Although it has the same thermal expansion coefficient as that of W - 10, the thermal conductivity is improved by a special manufacturing method; moreover, it is widely used for sub-mount applications for high power lasers because it can keep warp small. 12.1 300