A.L.M.T. Corp.

Ceramics

AlN

AlN

AIN is a material with high electric insulation and low dielectric constant, making it possible to form various metallized thin films on the surface, for electric circuits, chip mounting, and wire bonding.

Application Semiconductor laser submount, LED substrate, etc.

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Material Trade Name/Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 400℃
Thermal conductivity
[W/ (m・K)]
R.T.
AlN AlN(200W) Useful when insulation and patterns are required 4.5 >200
AlN(170W) 4.5 >170

Sintered Al-SiC

Sintered Al-SiC

Sintered Al-SiC is a heatspreader easily applied for relatively complex shaped parts production such as “lid shape”. Specific gravity is 1/3 of Cu. By adjusting the composite ratio of Al and SiC, it is possible to customize the thermal expansion to required specification.
With its young's modulus as small as 1/2 of iron, it can also be used as stress relaxation material. The surface has excellent adhesion of adhesives.

Application ECU for control, MPU, DSP, System LSI, Router LSI, etc

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Material Type Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 400℃
Thermal conductivity
[W/ (m・K)]
R.T.
Al-SiC β8 70SiC-30Al Without requiring processing thanks to a special mold, it can be manufactured cost-effectively. The thermal expansion coefficient is variable according to the package type. 8 140
β9 65SiC-35Al 9 130
β14 45SiC-55Al 14 160

Mg-SiC

MgSiC

Standard materials are light weight and have a low coefficient of thermal expansion of 7.0 ppm and high thermal conductivity of 230 W/(m・K). The composition ratio of Mg and SiC may be varied to offer customized thermal expansion. There is little variation in warping and the warp shape can be maintained stably after heat-cycle testing.

Application Power module for electric railway, industrial machinery and automotive (HEV).

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Material Trade Name Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 120℃
Thermal conductivity
[W/ (m・K)]
R.T.
Mg-SiC Mg-SiC 18Mg-SiC Being lightweight, it is suitable for use on large boards; in addition, it has stable warp, excellent high thermal conductivity and heat radiation. 7.0 230