A.L.M.T. Corp.

Diamond

Sumicrystal

Sumicrystal

Sumicrystal is a synthetic diamond single crystal with the highest thermal conductivity among the world's materials. It allows the forming of various metallized thin films for chip mounting and wire bonding.

Application Semiconductor laser submount, etc.

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Material Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 100℃
Thermal conductivity
[W/ (m・K)]
R.T
Sumicrystal A heatspreader of diamond having the highest thermal conductivity among substances. 2.3 2000

CVD diamond

CVD diamond

CVD diamond is polycrystalline diamond without binder, obtained by the Chemical Vapor Deposition (CVD) method. It allows the forming of various metallized thin films for chip mount and wire bonding.

Application Semiconductor laser submount, power transistor substrate,etc.

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Material Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 100℃
Thermal conductivity
[W/ (m・K)]
R.T.
CVD-Diamond A heatspreader of diamond of 0.1 to 0.4 mm produced by the CVD (Chemical Vapor Deposition) method. 2.3 >1000

DMCH (Cu-Diamond)

DMCH

DMCH is a composite material of diamond and Cu. Although it has thermal expansion coefficient close to that of GaAs-or GaN-compound semiconductor material, it has thermal conductivity higher than that of Cu. It allows the forming of various metallized thin films for chip mounting and wire bonding.

Application Semiconductor laser submount, power transistor substrate, etc.

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Material Type Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 400℃
Thermal conductivity
[W/ (m・K)]
R.T.
DMCH  Diamond-Metal DC60 Cu-Diamond A heatspreader of high thermal conductivity having a coefficient of thermal expansion suitable for compound semiconductors (GaAs, GaN). 6.0 550
DC70 6.5 500

DMCH (Ag-Diamond)

Ag-Diamond

Composite material of Silver and Diamond, the thermal conductivity is ≧600W/mK and higher than Copper Diamond.
The Ag-Diamond is applicable to large size purpose, like as 50×50mm2.

Application Wireless communication, Ceramics package, Power transistor substrate, MPU, etc.

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Material Type Composition Characteristics Coefficient of Average Linear Thermal Expansion
[ppm/K]
R.T. to 800℃
Thermal conductivity
[W/ (m・K)]
R.T.
DMCH  Diamond-Metal AC90 Ag-Diamond The thermal conductivity is ≧600W/mK and higher than Cu-Diamond.
It is applicable to large size purpose, like as 50×50mm2.
10.5 600