A.L.M.T. Corp.

Pure metal

Pure Mo


These have low thermal expansion close to Si chips, and superior mechanical properties. These are most suitable for high-power / high-reliability heatspreader.
Various machining processes including stamping can be done on these materials.

Application For diode and thyristor, Power transistor substrate, LED substrate, etc.

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Material Characteristics Coefficient of Average Linear Thermal Expansion [ppm/K] R.T. to 800℃ Thermal Conductivity [W/ (m・K)] R.T.
Molybdenum Thermal expansion is close to semiconductor (Si, GaN, SiC), widely used to reduce thermal stress on semiconductor. 5.7 142