These have low thermal expansion close to Si chips, and superior mechanical properties. These are most suitable for high-power / high-reliability heatspreader.
Various machining processes including stamping can be done on these materials.
|Application||For diode and thyristor, Power transistor substrate, LED substrate, etc.|
To see the whole table, scroll sideways.
|Material||Characteristics||Coefficient of Average Linear Thermal Expansion [ppm/K] R.T. to 800℃||Thermal Conductivity [W/ (m・K)] R.T.|
|Molybdenum||Thermal expansion is close to semiconductor (Si, GaN, SiC), widely used to reduce thermal stress on semiconductor.||5.7||142|