Adequately treated surface is needed for heatspreaders to bond semiconductor elements and package members. Also a good surface condition is necessary to provide highly reliable members that will not rust or corrode under severe environmental conditions. We have a wide variety of surface treatment facilities. And as part of the integrated manufacturing process including processing raw materials, we conduct such surface treatment operations as plating and metalizing.
Heatspreaders need to quickly release the heat generated by semiconductor operation to the radiator plate, etc. To join them are various methods such as Ag brazing, Pb-free solder, Au solder, Ag nano-paste, etc. For this purpose, we can conduct Ni electro-plating, Ni-P electro-less plating, electric Au plating, etc. We also conduct plating with good adhesion to W and Mo, which have poor plating properties, ensuring good heat radiation.
We have preliminary solder* products that simplify the production process of bonding the power modular semiconductor and heatspreader, improve bonding reliability, increase yield, and simplify managing the purchase of parts.
(*heatspreader with solder)
We form a solder film of Au/Sn eutectic alloy suitable for bonding of semiconductor elements using our film forming technology. We can adjust the composition ratio of Au and Sn at request. By forming a film on the sub-mount, workability and yield improvement during the semiconductor elements bonding process can be expected.
We can form fine patterns of Ti, Ni, Cr, Pt, Cu and Au by using a photosensitive resist on the AlN substrate.
The standard line and space (L/S) is 50 μm/50 μm, but it is available for up to 30 μm/30 μm.