A.L.M.T. Corp.

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Heatspreader applications

Heatsink products we produce are used in various fields.

High output devices for wireless communication

Plastic package

Ceramic packages

Circuit boards for metal packages

High output device for cars and trains

Base substrate for power module

Heat buffer plates

High power devices for optical communication

Sub-mount/carrier

LD packages

LSI parts

Ceramic package substrate

Lid (for ceramics/organic packages)

LD parts

Bar laser type

LED parts

Support substrate