Diamond Tools and cBN Tools
CMP Conditioner capable of retaining stable conditioning performance for long hours.
An optimized abrasive grain layer structure that follows elastic deformation of a pad makes abrasives work efficiently and provides longer life.
Conditioning of polishing pads used for flattening (CMP) of metallic films and insulating films in the semiconductor LSI process.
Concept showing features of New Type
Long life realized by New Type.