2013.12.07 “SEMICON JAPAN 2013″ had finished successfully. Thank you for visiting the booth of A.L.M.T. Corp.
“SEMICON Japan 2013″ is one of the biggest international exhibitions of semiconductor equipment and materials. All the related products would be exhibited by varieties of Exhibitors of some 1,000 companies.
“A.L.M.T.Corp.” is the leading company of diamond precision tools. We would exhibit many kinds of diamond high performance cutting and grinding tools. And we also exhibit tooled wafers by our special diamond wheels.
Taking this opportunity, you are cordially invited to visit our booth and use as a space to exchange information and to find out the turn-key solution for your further development.
SEMICON Japan 2013
• Date : December 4 (Wed) – December 6 (Fri), 2013
• Venue : Makuhari Messe, Chiba, Japan
• Stand : Hall 4 4A-601
• Major Exhibits
Grinding diamond tools for Crystal wafer
Diamond grinding wheel for sapphire, SiC
“Cutting and Slicing Tools”
BL-UPC : Ultra precision Diamond cutting tools adopted SUMI-DIA Binderless
(Nano-polycrystalline Diamond) and UPC Nano series.
PWS : Precision Diamond Wire Saw.
Various grinded and polished works (Si, SiC, Sapphire, LT, MEMS wafer etc)
Cut works (Silicon lens, Cemented carbide etc)
Please refer further detailed information with regards to the exhibition to