Tungsten, molybdenum and heatspreader materials

Heatspreader materials

Heatspreader materials

High-performance heatspreader materials have a high thermal conductivity and meet a wide range of required coefficients of thermal expansion.
(Only one manufacturer of highly functional heatspreader materials in the world)

Thermal properties of heatspreader materials
Thermal properties of heatspreader materials

Click here for the properties of heatspreader materials.

  • For automobile and industrial machinery
    For automobile and industrial machinery
  • Parts for LSI
    Parts for LSI
  • Parts for wireless devices
    Parts for wireless devices
  • Parts for optical communication
    Parts for optical communication
  • Parts for LD
    Parts for LD
  • Parts for LED
    Parts for LED

1.Metals category
Pure Mo, Pure W

These have low thermal expansion close to Si chips, and superior mechanical properties. These are most suitable for high-power/high-reliability heatspreader. Various machining processes including pressing can be done on these materials.

■Application: For diode and thyristor, power transistor substrate, LED substrate, etc.

Pure Mo, Pure W

2.Metal composites, alloy category
Cu-W

Cu-W is a combination of W which has low thermal expansion and Cu which has high thermal conductivity. Thermal expansion can be adjusted to those of Alumina and Kovar materials. Also, with good machinability, it is possible to manufacture the parts with small-complicated shapes.

■Application: Wireless communication, opto electronics, LED substrate, MPU, etc.

Cu-W
Cu-Mo

Cu-Mo is suitable for rolling and pressing processes. Thermal expansion and thermal conductivity are adjustable with this material. Since the “Clad” material’s surface is pure Cu, the heat dissipation on surface layer is larger.

■Application: Wireless communication, plastic package, power transistor substrate, LED substrate, etc.

Cu-Mo

3.Ceramics category
AIN

AIN has a high electric insulation and low dielectric constant. Various metallizing processing is possible with this material.

■Application: Semiconductor laser submount, LED substrate, etc.

AIN

4.Ceramics-metal category
Sintered Al-SiC

Sintered Al-SiC is a heatspreader easily applied for relatively complex shaped parts production such as “lid shape”. Specific gravity is 1/3 of Cu. By adjusting the composite ratio of Al and SiC, it is possible to customize the thermal expansion to required specification. Moreover, as an option it is possible to laminate an aluminum layer on the surface.

■Application: MPU, DSP, System LSI, Router LSI, etc.

Copper-Buster(Al-SiC)
MgSiC

MgSiC is a heatspreader which has the same low thermal expansion as AlSiC while higher thermal conductivity and lower specific gravity than AlSiC.

■Application: Power module for electric railway, industrial machinery and automotive(HEV).

Invader(Si-SiC)

5. Diamonds category
Sumicrystal

Our original ultrahigh pressure technology enables the production of synthetic single crystal diamonds which possess one of the best thermal conductivities of all known materials.

■Application: Semiconductor laser submount, etc.

Sumicrystal
CVD diamond

Because of its binderless polycrystalline structure, our CVD diamond exhibits a high thermal conductivity approaching that of single crystal diamond. Large diamonds can be made and can be applied in wide number of applications.

■Application: Semiconductor laser submount, power transistor substrate, etc.

CVD diamond
DMCH Diamond-Cu

Composite material of diamond and copper with thermal expansions similar to InP or GaAs and thermal conductivity higher than copper.

■Application: Semiconductor laser submount, power transistor substrate, etc.

DMCH

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