"19th International Conference and Exhibition on Device Packaging" was a successful event! Thank you for visiting our booth.
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A.L.M.T. Corp. will exhibit at 19th International Conference and Exhibition on Device Packaging, scheduled from 14-15, March, 2023. There we will introduce thermal solutions with heatspreaders. 19th International Conference and Exhibition on Device Packaging 2023 ･Dates : 14-15, March (Conference:13-16, March)･Place: WeKoPa Resort and Conference Center (AZ, the U.S.) ･Booth#: 12 ･Floor map: https://imaps.org/device_packaging_exhibits.php#exhibitorlist ･Registration: https://www.imaps.org/device_packaging_conference.php#register ◆Main Exhibits： 1. Ag-Diamond Heatspreader  2. Support Wafer for wafer bonding (Cu-W, Mo)  ※ For further detailed information about the exhibition, please check the official website below. https://www.imaps.org/device_packaging_conference.php |