A.L.M.T. Corp.

ホーム > HOME > R&D/ Service > R & D of Diamond/ CBN tools

R&D of Diamond/CBN tools

R & D aiming for high-efficiency, high-performance, and environmental friendliness

Tools made from diamond, the hardest substance in the world, and from cubic boron nitride (CBN) with hardness akin to diamond are used in various industries around the world.

Recently, technological innovation has further accelerated, with the increasing demand for diamond/CBN tools. We are developing tools to meet market needs while conducting research and development, anticipating the future.

In the diamond products business, we are committed to developing new products and new technologies with the themes: "high efficiency processing," "high-performance processing at nano level" and "environmentally friendly processing."

Example of applications Improved efficiency, longer life and higher accuracy in finishing holes of sintered alloy and cast iron.
R & D aiming for high-efficiency, high-performance, and environmental friendliness

Diamond wheel for grinding semiconductor material “Nanomate ® premium” series

We are developing diamond wheels for grinding various semiconductor materials.
Making full use of the know-how of semiconductor material processing we have cultivated over the years, we have realized a dedicated design tailored to the characteristics of each material and processing needs.

半導体材料研削用ダイヤモンドホイール「ナノメイト®プレミアム」シリーズ

LiTaO3 (LT) wheel for wafer grinding

Challenges of LT wafer processing
  • ・Cleaving occurs in the LT wafer, which is the characteristic of a single crystal; even a slight stress causes the whole substrate to crack.
  • ・Thermal expansion coefficient varies significantly according to the crystal orientation. When it is exposed to thermal change, stress distortion occurs inside, breaking it instantaneously.
従来ボディ
Bond design and new body development specialized for LT wafer achieved low damage/low load processing
  • ・Cleaving occurs in the LT wafer, which is the characteristic of a single crystal; even a slight stress causes the whole substrate to crack.
  • ・Thermal expansion coefficient varies significantly according to the crystal orientation. When it is exposed to thermal change, stress distortion occurs inside, breaking it instantaneously.
新開発ボディ
スピンドル負荷電流値
Feed rate 60 20 120 20 60 20
Wafer size 4 in.
Conventional wheel
4in.
Newly developed
6in.
Newly developed

Wheel for grinding WLP/FOWLP substrate

Challenges of grinding WLP/FOWLP substrate
  • ・Grinding causes metal drag and resin tear
  • ・Conventional grinding wheels cause clogging of metal and resin
Conventional wheel Conventional wheel
Characteristics of newly developed bond
  • ・Grinding of elastic plastic material is possible.
  • ・Drag and tear of metal and resin are suppressed.
  • ・Continuous grinding by maintaining sharpness is possible.
Nanomate premium#2000 Nanomate premium#2000

Wheel for grinding MEMS substrate

Challenge of grinding MEMS
  • ・When grinding the silicon wafer, breaks occur in the hollow layer in the silicon or glass substrate.
Challenge of grinding MEMS
Current wheel Current wheel
Characteristics of newly developed bond
  • ・Low load processing enables crack-free processing.
  • ・Continuous grinding of through holes and deep drilling wafers is possible.
Nanomate premium#6000 Nanomate premium#6000

CBN reamer

Tools made of ultra-hard materials are mainly used for hole finishing of sintered alloy or cast iron, which are widely used in the automobile field; nevertheless, higher efficiency and longer service life are still required. To meet these needs, we have developed tools using CBN material suitable for machining sintered alloy and cast iron.
We succeeded in developing a CBN reamer that can achieve dramatically high efficiency, long life and high precision compared with cemented carbide tools.

CBNリーマ

Hole processing of sintered metal gear shafts

Tool used
Blade material CBN made by Sumitomo Electric
Size Φ8-4 blades, L/D5
Coolant JISW1 type 8% dilution (Emulsion)
Machining condition
V 250 m/min
F 1,200 mm/min
ap Φ 0.2 mm
Hole processing of sintered metal gear shafts
  • Basic information about Diamond/ CBN tools
  • Q&A about Diamond/ CBN tools