A high performance heatspreader is indispensable to achieve the design performance of the semiconductors being developed day by day. We are working to develop new heatspreaders day and night by taking each customer's request individually.
Mg-SiC, manufactured from Mg ingot and SiC powder using our own powder filling and infiltration technologies, is suitable for the mass production of large products.
We can change the composition ratio of Mg and SiC for the Mg-SiC material having thermal expansion of 7.0 ppm and thermal conductivity of 230 W/mK to customize the thermal expansion.
Its shape can be kept stable even during the heat cycle test because of the small variation of the warped shape.
CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material. Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
It is mainly used for wireless communications, especially amplifier substrates of mobile phone base stations.