A high performance heatspreader is indispensable to activate semiconductor performances. We are now working on developing new heatspreaders to meet each customer's request .
Mg-SiC, manufactured from Mg ingot and SiC powder using our own forming and infiltration technologies, is suitable for mass production at large size.
Standard Mg-SiC material has thermal expansion of 7.0 ppm and thermal conductivity of 230 W/(m・K). Moreover, changing composition ratio of Mg and SiC, coefficient of thermal expansion can be customized.
As it has small variations, its warped shape can be kept stable even after the heat cycle test.
CPC(copper, copper-molybdenum, copper) is a composite material with a laminated structure with cooper-molybdenum (Cu-Mo) sadwitched between copper layers. Thermal conductivity and coefficient of thermal expansion can be adjusted by changing composition and lamination ratio of Cu-Mo.
In addition, as both surfaces are copper, the initial heat dissipation effect is excellent.
It is mainly used for amplifier substrates of cell base stations in wireless communications fields.