Research and Development/Customer service

Customer solution center

Optimum process suggestions of Cutting/Grinding parameters

A.L.M.T. Corp. have established Customer Solution Center (CSC) in A.L.M.T. DIAMOND Corp. Harima Works for the sake of fulfilling every process requirement from our customers with optimum suggestion of Cutting/Grinding parameters though CSC’s wide range of experiment.

A.L.M.T. DIAMOND Corp.
Customer solution center

1816-174, Kotaka-Kuroishi, Kato City, Hyogo 679-0221 Japan
TEL:+81-795-48-5067, FAX:+81-795-48-5071

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A.L.M.T. DIAMOND Corp. Customer solution center

評価一覧

Grinding to Cutting

Propose  high precision and high efficiency cutting process that realizes space saving and clean environment<br />
Propose super precision and high efficient Cutting process that enables down-sizing and clean environment.

Free abrasive to Grinding

Free abrasive to Grinding
Propose super precision and high efficient grinding process leading low work-piece damage under clean condition that achieves improvement of working environment and washability of work-piece as well as reducing industrial waste.

Measurement to analysis and evaluation

Measurement to analysis and evaluation
Propose evaluation methods after process as total analysis system.

Cutting process evaluation system

Optimum process suggestions of Turning/Milling/Drilling methods

Observing cut chips with high speed camera to measure the process load by a tool dynamometer and analyzing every parameter fluctuation,
CSC would provide you with optimum methods such as tool specifications, process conditions and parameters.
Cutting process evaluation system

Photo by high speed camera

Photo by high speed camera

Grinding process evaluation system

Optimum process suggestions of Grinding parameters

Evaluating sorts of grinding wheels under variety of process conditions by a grinding machine equipped with on-machine truing/dressing system and analyzing grinding force, load current and every parameter fluctuation, CSC would provide you with optimum methods such as tool specifications, process conditions and parameters and work-piece evaluation/analysis as well as tool evaluation/analysis.

Grinding process evaluation system

Grinding process example of each specification

Grinding process example of each specification

Analysis and evaluation

Provide with work-piece measuring, analysis and tool analysis

CSC would provide you with wafer standard measuring, machined wafer surface 3-D analysis and wafer process conditions analysis.

Analysis of flatness and waviness
3-D flat face analysis unit : TROPEL

Analysis of flatness and waviness

3-D flat face analysis unit : TROPEL

Measure and analyze wafer surface up to 200mmD.
・Measurement accuracy : 0.1um
・Measurement range : 100um

Surface analysis
3-D surface analysis unit Zygo

Surface analysis

3-D surface analysis unit  Zygo

2-D and 3-D surface status are obtained by nondestructive inspection
・Analysis ability of height direction : 0.1nm
・Vertical scanning speed : 4um/sec


Observation by high magunification and component
analysis : EDX-SEM

Observation by high magunification and component<br />
analysis : EDX-SEM

Observe and analyze up to 200mm for diameter , 10mm (straight type) and 40mm (cup type) for height


Surface x 500 Surface analysis

Electro microscope
Electro microscope

C (Diamond)
C (Diamond))

Cu (Filler)
Cu (Filler)

Ni (Coating material)
Ni (Coating material)

Cutting/Grinding resistance
Tool dynamometer (by Kistler)

Cutting/Grinding resistance

Tool dynamometer (by Kistler)

Process characteristic are grasped by comparing 3 force components.