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2016.12.19 “SEMICON JAPAN 2016″ had finished successfully. Thank you for visiting the booth of A.L.M.T. Corp.

We are going to exhibit again at “SEMICON Japan 2016″ to be held in Tokyo, Japan from Wednesday December 14 to Friday 16, 2016.
 
Having the concept “Takumi no Waza”, the skill of professionals, we will display machining tools and suggest the best processing application suggestion.
 
Taking this opportunity, please visit our booth and use it as a space to exchange information and find out the turn-key solution for your further development.
 
SEMICON Japan 2016
• Date : December 14 (Wed) – December 16 (Fri), 2016
• Venue : Tokyo Big Sight, Tokyo , Japan
• Stand : Hall East2 2037
 
• Major Exhibits
“Grinding Wheels”
“Nanomate Premium” for SiC, Si-Sapphire, LT wafer
CMP pad conditioners
 
“Cutting Tools”
Nano-Polycrystalline Diamond Tool for Carbide, Ni Plating, Quenching 《BL-UPC》,
Single Crystal Diamond Tool for Mirror machining Poly carbonate 《UPC》
 
“Drawing Dies”
Diamond Drawing Dies for bonding wire
 
“Processing consultation section”
Please feel free to talk to us about processing.
 
“Other accessories”
Heatspreader Materials
 
Please refer further detailed information with regards to the exhibition to
http://www.semiconjapan.org/en/