Research and Development
Highly efficient electroplated wheel having improved “cutting ability” and “evacuation of chips.” Fine slit electroplated wheel
In order to overcome this drawback, we have developed a technology to form slits by fine masking during electroplating, which enables it to control the number of active grains as needed.
・Evacuation of chips is improved (thanks to fine slits).
・Applicable to formed wheels also.
・Grain fixing area: Settable freely (50% – 80%)
・Grain: Diamond, CBN
・Grain size: #80 – 325
・Wheel size: OD φ40 – 300 mm x width 5 – 100 mm
・Grain layer: Straight, formed
Examples of application
※The conventional electroplated wheel caused burn due to loading by chips and was unable to continue grinding. The fine slit electroplated wheel suffered no loading by chips and continued grinding with a consistent grinding force (cutting ability) up to the end.