2012.12.10 “SEMICON JAPAN 2012″ had finished successfully. Thank you for visiting the booth of A.L.M.T. Corp.

We will appear again at “SEMICON JAPAN 2012 ” to be held in Makuhari, Japan from Wednesday December 5 to Friday 7, 2012.

“SEMICON Japan 2012″ is one of the biggest international exhibitions of semiconductor equipment and materials. All the related products would be exhibited by varieties of Exhibitors of some 1,000 companies.

“A.L.M.T.Corp.” is the leading company of diamond precision tools. We would exhibit many kinds of diamond high performance cutting and grinding tools.

Taking this opportunity, you are cordially invited to visit our booth and use as a space to exchange information and to find out the turn-key solution for your further development.

SEMICON Japan 2012
• Date : December 5 (Wed) – December 7 (Fri), 2012
• Venue : Makuhari Messe, Chiba, Japan
• Stand : Hall 4 4C-701

• Major Exhibits
“Grinding Wheels”
   Grinding diamond tools for Si wafer
   Diamond grinding wheel for sapphire, SiC
“Cutting and Slicing Tools”
   Ultra precision Diamond cutting tools adopted SUMI-DIA Binderless (BL-UPC)
   and UPC Nano series.
   Precision Diamond Wire Saw. (PWS), Diamond core drill (Sygrix)
“Other accessories”
   Various grinded and polished works (Si, SiC, Sapphire MEMS wafer etc)
Please refer further detailed information with regards to the exhibition to