A.L.M.T. Corp.

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CIOE was a successful event! Thank you for visiting our booth.

A.L.M.T. Corp. will participate in CIOE Exhibition, scheduled on 4-7, September, 2019.
This exhibition is international exhibition and conference for optoelectronic and photonic industries.


CIOE Exhibition (China International Optoelectronic Expo)

  • Dates : 4-7, September, 2019
  • Venue : Shenzhen Convention & Exhibition Center China (Shenzhen, China)
  • Stand : Booth 2532, Hall2, A.L.M.T. Corp.


Main Exhibits; Heatspreaders


Cu-W Heatspreader

・Consistent in-house Process. (Ingot~Machining~Plating)

・Precise Machining for Complicated Figure.

・High Stiffness, High Thermal Conductivity, and Close to Coefficient of Thermal Expansion of Ceramics and Kover.

・Huge Capacity.


AlN Submount

・High Electric Insulation.

・Various Metallization (including AuSn Solder Pre-Coating )


CPC Heatspreader (Cu, Cu-Mo, Cu Laminated)

・Wide Variety of Thermal Conductivity & Coefficient of Thermal Expansion.

・Huge Capacity with Rolling and Stamping Processes.

・Excellent Heat Dissipation for High Performance Devices.


For further detailed information about the exhibition, please refer to