A.L.M.T. Corp. will participate in IMS2019, scheduled from 4-6, June, 2019.
This exhibition is International Microwave symposium.
There we will exhibit mainly heatspreaders, including Ag-Diamond, CPC.
Main Exhibits; Heatspreaders
Characteristics: High Thermal Conductivity, more than 600 W/mK. Low Co-Efficient Thermal Expansion, less than Pure Copper.
High heat resistance; It can be assembled by normal silver-brazing at 800C.
Applications: High Performance Ceramics Package, Heatspreader for SiC/GaN High Powered Device.
Characteristics: CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material.
Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo
and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
Applications: Amplifier substrates of mobile phone base stations.
For further detailed information about the exhibition, please refer to https://ims-ieee.org/