A virtual conference, "17th International Conference on Device Packaging", on 12-15, Apr. was a successful event! Thank you for visiting our booth.
Dear Sir or Madam,
A.L.M.T. Corp. is going to participate virtually in the 17th International Conference on Device Packaging, on 12-15, April. And there, we'll deliver a technical presentation about our latest heatspreader, Ag-Diamond! CLICK HERE for the official website!
Here are some of our main exhibits:
Ag-Diamond Heatspreader
･High thermal conductivity, more than 600 W/(m･K).
･Low coefficient of thermal expansion.
･Resistance for high temperature; It can be assembled by silver-brazing at 780℃.
CPC (Cu/CuMo/Cu) Heatspreader
･High thermal conductivity.
･The coefficient of thermal expansion is adjustable.
･Available with mass production.
Metal Support Wafers :Mo, Cu-Mo and Cu-W
･High thermal conductivity.
･The thermal expansion is so close to semiconductor wafers (Si, GaN, SiC).
･Ni/Au plating for soldering are available.
If you're interested in these thermal solution items, please visit the website of the event :)
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17th International Conference on Device Packaging
Date ：12-15, April, 2021
Website (registration): CLICK HERE
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17th International Conference and Exhibition on Device Packaging