We will exhibit at "20th International Conference and Exhibition on Device Packaging"!
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A.L.M.T. Corp. will exhibit at 20th International Conference and Exhibition on Device Packaging, scheduled from 19-20, March, 2024. There we will introduce thermal solutions with heat Spreaders. 20th International Conference and Exhibition on Device Packaging 2024 ･Dates : 19-20, March (Conference:18-21, March)･Place: WeKoPa Resort (AZ, the U.S.) ･Booth#: 2 ･Floor map: IMAPS DPC 2024 - International Microelectronics Assembly and Packaging Society ･Registration: International Microelectronics Assembly and Packaging Society (imaps.org) ◆Main Exhibits： Ag-Diamond Heatspreader  ※ For further detailed information about the exhibition, please check the official website below. IMAPS Device Packaging Conference |