ホーム > HOME > Product Information > Heatspreader materials Top > spn_Heatspreader for Semiconductor Devices
Heatspreader
Thermal Solution for Semiconductor Devices!
- High and Stable Thermal Conductivity!
- Excellent Shape Stability!
- Adjustable Coefficient of Thermal Expansion to Device and Packaging Materials!
For Base Plate
MAGSICTM (Mg-SiC) / Cu-Mo Heatspreader
- High thermal conductivity.
- Excellent shape stability under high-temperature operation for a long time.
For Thermal Buffer Plate
Cu-Mo (CPC TM) Heatspreader
- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.
Ag-Diamond Heatspreader
-High thermal conductivity, more than 600 W/(m･K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.
For Double Side Cooling (Spacers)
Cu-Mo (CPC TM) Heatspreader
- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.
Ag-Diamond Heatspreader
-High thermal conductivity, more than 600 W/(m･K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.