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Heatspreader

Thermal Solution for Semiconductor Devices!




- High and Stable Thermal Conductivity!

- Excellent Shape Stability!

- Adjustable Coefficient of Thermal Expansion to Device and Packaging Materials!


heatspreader application     heatspreader application    

For Base Plate

MAGSICTM (Mg-SiC) / Cu-Mo Heatspreader

- High thermal conductivity.
- Excellent shape stability
under high-temperature operation for a long time
.


 

For Thermal Buffer Plate

Cu-Mo (CPC TM) Heatspreader

- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.

Ag-Diamond Heatspreader

-High thermal conductivity, more than 600 W/(m・K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.



 

For Double Side Cooling (Spacers)

Cu-Mo (CPC TM) Heatspreader

- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.

Ag-Diamond Heatspreader

-High thermal conductivity, more than 600 W/(m・K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.