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A.L.M.T. Corp.

Tin-Plating dies

Tin-Plating dies
Tin-Plating dies

Design to minimize adhesion of tin to the case.

This die is used to adjust the thickness of plating of tin-plated copper wires. The use of special case material minimizes adhesion of tin to the case.

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Characteristics

  • Special titanium material used for the case to minimize adhesion of tin to the case. Standard case size φ25x7 mm.

Applications

Adjusting the thickness of plating of tin-plated copper wires

Industries

  • 伸線機器

Work Material

  • Others

Processing Method

  • 伸線加工,その他

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