A high performance heatspreader is indispensable to achieve the design performance of the semiconductors being developed day by day. We are working to develop new heatspreaders day and night by taking each customer's request individually.
Mg-SiC, manufactured from Mg ingot and SiC powder using our own powder filling and infiltration technologies, is suitable for the mass production of large products.
We can change the composition ratio of Mg and SiC for the Mg-SiC material having thermal expansion of 7.0 ppm and thermal conductivity of 230 W/mK to customize the thermal expansion.
Its shape can be kept stable even during the heat cycle test because of the small variation of the warped shape.
|Coefficient of average linear thermal expantion(R.T.～120℃)||7.0ppm/K|
|Transverse rupture strength||400MPa|
Ag, having a higher thermal conductivity than Cu, is the material with the highest thermal conductivity among metals. This Ag and diamond powder are mixed and sintered by our own technology to successfully produce a new material with thermal conductivity of 600 W or more. This new material, allowing us to manufacture materials larger than the conventional diamond materials, is the diamond heat radiation material to be used for various applications including the PKG base plates for large output and the heat dissipation substrate for large-size devices.
In addition, it provides a lower decrease in thermal conductivity caused by heat history than the conventional diamond materials.
We can apply a highly heat resistant plating film capable of general silver brazing to the surface, or offer an assembly product of this Ag-Diamond partially soldered to the base material of Cu, etc.
Characteristics (Typical value)
|Thermal conductivity (23℃)||630W/(m･K)|
|Specific heat||0.34 kJ/kg･K|
after 800℃ heat treatment
|Young’s modulus (23℃)||346 GPa|
|Tensile strength (23℃)||390 MPa|
|Poisson’s ratio (23℃)||0.24|
CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material. Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
It is mainly used for wireless communications, especially amplifier substrates of mobile phone base stations.