We offer a wide variety of heatspreaders of high thermal conductivity to meet various needs of customers.
These have low thermal expansion close to Si chips, and superior mechanical properties. These are most suitable for high-power/high-reliability heatspreader. Various machining processes including pressing can be done on these materials.
Composite materials of copper and tungsten or molybdenum. By varying the percentage of copper, a wide range of coefficients of thermal expansion (6.5 to 13.5 ppm/K RT - 800°) is available.
Al-SiC produced from Al powder and SiC powder using powder metallurgy technology is suitable for small volume production. MgSiC produced from Mg mass and SiC powder using infiltration technology is suitable for large-volume production. AlN is a material with high electric insulation and low dielectric constant. Various metallization treatments are available at your request.
Diamond has higher thermal conductivity about 5 times that of copper. Using our own technology, we offer a variety of diamond materials such as synthetic diamond single crystal (Sumicrystal), high purity polycrystalline diamond (CVD diamond), composite material of metal, and diamond (Cu-Diamond, Ag-Diamond).
Adequately treated surface is needed for heatspreaders to bond semiconductor elements and package members. Also a good surface condition is necessary to provide highly reliable members that will not rust or corrode under severe environmental conditions. We have a wide variety of surface treatment facilities. And as part of the integrated manufacturing process including processing raw materials, we conduct such surface treatment operations as plating and metalizing.
Heatspreaders used for optical communication are required to have high form accuracy in the order of micron. Submounts for high-power laser need to have sharp edges. A.L.M.T. owns many machine tools including machining centers and electric discharge machines to do highly precise machining internally.