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Molybdenum Alloy (MSB series, TZM) has high resistance at high temperature. Then, it enables to obtain better dimensional accuracy of the extruded product and give less damage on it.
Cu-Diamond has thermal expansion close to compound semiconductors and higher thermal conductivity than copper. (>500 W/m・K)
Cu-W is a composite material of copper (having high thermal conductivity) and Tungsten (having low thermal expansion rate), and its thermal expansion ratio is adjustable depending on surrounding materials.
Mo has thermal expansion close to semiconductor chips (Si, GaN, Si) and can reduce thermal stress on the chips.
Cu-W / Cu-Mo is a composite material of copper (having high thermal conductivity) and tungsten / molybdenum(having low thermal expansion ratio), and its thermal expansion ratio is adjustable depending on assembling materials.
CPC is a 3 layered composite material, copper, copper-molybdenum and copper. Controlling composition of copper molybdenum and laminated thickness of copper, thermal conductivity ratio and thermal expansion ratio is adjustable depending on customers' requests.
As its surface is copper, it is superior in initial heat dissipation. And mass-production is available.
With Ag, having the highest thermal conductivity among metals, and Diamond, having the highest thermal conductivity among substances on earth, Ag-Diamond has high thermal conductivity: more than 600 W/(m・K)
It is suitable for high performance devices for aerospace industries.