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Cu-Diamond/Cu-W Submount for Multi Emit Diode Laser Bar

Cu-Diamond/Cu-W Submount for Multi Dode Lase Bar

Data summary

Cu-Diamond has thermal expansion close to compound semiconductors and higher thermal conductivity than copper. (>500 W/m・K)
Cu-W is a composite material of copper (having high thermal conductivity) and Tungsten (having low thermal expansion rate), and its thermal expansion ratio is adjustable depending on surrounding materials.

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