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Metal Support Wafer for Wafer Bonding(Pure-Mo, Cu-Mo Alloy, Cu-W Alloy)

Metal Support Wafer for Wafer Bonding(Pure-Mo, Cu-Mo Alloy, Cu-W Alloy)

Data summary

Mo has thermal expansion close to semiconductor chips (Si, GaN, Si) and can reduce thermal stress on the chips.
Cu-W / Cu-Mo is a composite material of copper (having high thermal conductivity) and tungsten / molybdenum(having low thermal expansion ratio), and its thermal expansion ratio is adjustable depending on assembling materials.

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