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Heatspreader (heat dissipation plate) by Applications

Heatspreaders for wireless communications

Heatspreader for wireless communications

Contributing to High-speed, High-capacity for Mobile Networks

With the high-speed and high-capacity of communications, and the miniaturization of devices, the amount of heat generated from semiconductors for wireless communications increased. Base stations (antennas) of 5G, which are at the start line of global popularization, are equipped with a number of GaN (gallium nitride) chips, which are compound semiconductors. Compared to the conventional silicon (Si) semiconductors, these semiconductors are smaller and have higher performance. However, because of their high density of heat generation (amount of heat generation per unit volume), efficient heat dissipation methods are indispensable to ensure the reliability of communications networks. In addition to Si semiconductors, A.L.M.T. Corp. offers various heatspreaders with high thermal conductivity and low thermal expansion, which are suitable for GaN semiconductors. And, the heat dissipation plates contribute to the next-generation mobile communications networks.

Applications Wireless communications, Cell base stations, Aircraft, Ships, Artificial satellites, etc.

Cu-W (Copper-Tungsten)

Cu-Mo (Copper-Molybdenum)

Ag-Diamond (Silver-Diamond)

CPC (Copper, Copper-Molybdenum, Copper)


Package Example

Plastic Package

Plastic Package

This package is used for devices of base stations that are compact and low-power.
They cover mobile phone networks densely in urban areas.
Cu-Mo (CPC) materials, which have a coefficient of thermal expansion close to semiconducting materials, are suitable for that use.

Ceramic Package

Ceramic Package

This package is used for devices of base stations with high output and covering a wide range of mobile phone networks.
Cu-Mo (CPC) and Cu-W, with a coefficient of thermal expansion close to ceramic housings, are suitable.

Metal Package for Circuit Board

Metal Package for Circuit Board

It is used in applications requiring high output and reliability, such as aerospace applications.
In addition to Cu-W and Cu-Mo with a close coefficient of thermal expansion to metallic housings such as Kovar, Ag-Diamond is used in the high-end area.

Heatspreaders for optical communications

Heatspreader for optical communications

Contributing to High-speed, High-capacity for Optical Communications

Fiber-optic networks covering the entire world, from the bottom of the sea to the land, have supported the high-speed and high-capacity of the Internet. For data centers that are being newly installed in various places, optical communications are still used to connect high-performance servers. Since laser diodes that oscillate optical signals become hot, the heat dissipation plate (submount) is mounted directly below them. Our heatspreaders have a wide variety of thermal expansion coefficients, and also have good machinability suitable for complex and high-precision packaging.

Applications Optical communications trunk networks, FTTx systems, Data centers, in-vehicle LAN, etc.

Cu-W (Copper-Tungsten)

Cu-Mo (Copper-Molybdenum)

Cu-Diamond (Copper-Diamond)

AlN (Aluminum Nitride)

CVD diamond (Chemical Vapor Deposition-Diamond)


Package Example

Optical Communication Package

Optical Communication Package

Laser modules, the core components of optical communications, are complex-shaped packages containing diodes, submounts, and carriers.
For the housing materials of these packages, Cu-W that have complex and micro-machinability are suitable among heatspreader materials.

Chip Carrier and Submount

Chip Carrier and Submount

Submounts are placed just below the laser diode to mitigate differences of the coefficient of thermal expansion with the parts below.
In addition to AlN and Cu-W with excellent thermal conductivity, Cu-Diamond is used for high-power lasers.
Also, micro-machined Cu-W is suitable for chip carriers.

Heatspreaders for automotive

Heatspreaders for automotive

Contributing to Safe Driving of Electric and Hybrid Vehicles

With a view of realizing decarburization, the global markets for EVs and HVs (PHVs and PHEV) are expected to grow. Power devices are indispensable for power control and power conversion in electric vehicles equipped with the batteries and motors. Especially for inverters and converters that support higher powertrain output, high-efficiency power semiconductor materials like SiC (silicon carbide) and modules cooled from both sides are utilized, where heat dissipation is regarded as important. HV internal combustion engines also require a heatspreader for the component such as fuel injection controllers and radiators, which are essential for safe driving. Our heatspreaders with high thermal conductivity contribute to the development of safe and secure automobiles.

Applications PCU(Power control unit) for Hybrid vehicle,Inverter and AT module for Electric vehicle, etc.

Cu-Mo (Copper-Molybdenum)

CPC (Copper, Copper-Molybdenum, Copper)

Mo (Molybdenum)

Al-SiC (Sintered Aluminum-Silicon Carbide)


Package Example

Thermal Buffer Plate

Thermal Buffer Plate

For heat dissipation of IGBT modules that control the current for motor drive, there is a cooling method that a metallic plate (Cu/Al) or a cooler is embedded.
Cu-Mo or Mo are joined between the semiconductor chip and the metallic plate to promote the heat dissipation and serve as a thermal buffer plate.

Lid (for ceramics/ organic package)

Lid (for ceramics/ organic package)

In the flipchip method, Al-SiC is used as a heat-dissipating plate called a lid that covers the package like a lid.
In addition to being lightweight, Al-SiC can be manufactured at low cost in relatively complex shapes such as lids by using dedicated molds.



Heatspreaders for High luminance LED

Heatspreader for High luminance LED

Contributing to Higher Luminance LED lighting

Compared to conventional light sources, LED (Light Emitting Diode) have a longer life and are more energy-efficient. Previously, it was limited to household lighting. But, due to the progress of high luminance, the application is expanding to automobile headlights, outdoor lighting, projectors, etc. as well. In the future, by controlling wavelengths of LED, it is also expected to be applied to sterilization of drinking water, interior vegetable cultivation, and medical treatment. On the other hand, LED chips, light-emitting sources, have heat-sensitive characteristics. So, its heat dissipation is indispensable for high-luminance LED devices, which tend to have high temperatures. Our heat dissipation materials have excellent thermal conductivity, and can be also processed in complex shape with our own techniques.。

Applications Projectors, Headlights, Outdoor lightings, etc.

Cu-W (Copper-Tungsten)

Cu-Mo (Copper-Molybdenum)

Mo (Molybdenum)

AlN (Aluminum Nitride)


Package Example

LED Substrate

LED Substrate

For heat dissipation of LED, which are increasingly becoming more high-performance, support wafers (Mo/ Cu-W/ Cu-Mo) that can be produced to large thin-plate are suitable.
After a light-emitting layer is formed on a sapphire wafer, a heatspreader is joined to peel off the sapphire base material. Dicing the material, a small and thin LED device is completed.

Submount and carrier

Submount and carrier

Submounts may be jointed directly below the LED chip for heat dissipation and bonding stress relaxation.
AlN, Cu-W and Cu-Diamond are used for the submount, and Cu-W is used for the carriers below them.



Heatspreaders for laser

Heatspreaders for laser

Contributing to Expansion of Applications for Semiconductor Lasers from Metal Processing to Medical Treatment

Laser processing machines are being increasingly popularized for drilling, cutting, welding, and quenching metals.
The field of lasers is also expanding including surgical laser scalpels, cancer treatments, and beauty surgery.
Semiconductor lasers (laser diodes) use compound semiconductor materials such as GaAs (gallium arsenide) and GaN (gallium nitride).
These semiconductor chips generate heat when oscillating lasers. So, the heat needs to be dissipated by a heatspreader with excellent thermal conductivity.
A.L.M.T. Corp. has many kinds of heatspreaders with high thermal conductivity and excellent coefficient of thermal expansion to match semiconductor materials.

Applications Welding, Cutting, Beauty care, Medical, Stack (laminated type), etc.

Cu-W (Copper-Tungsten)

AlN (Aluminum Nitride)

Cu-Diamond (Copper-Diamond)

CVD diamond (Chemical Vapor Deposition-Diamond)


Package Example

Pumping Bar Type

Pumping Bar Type

Heat dissipation is important to maintain the performance of bar laser semiconductors that emit laser light at high output.
Cu-W and Cu-diamond are suitable for submounts directly below the exit section, since they have high thermal conductivity and sharp-edge processing is available not to prevent laser emission.

Submount for Single Emitter

Submount for Single Emitter

The high-power fiber laser machine is embedded with many laser diodes (single-emitter-type).
AlN and Cu-W are used for submounts located directly below the injection part, where it is required to match a coefficient of thermal expansion with surrounding materials and to have high thermal conductivity.



Heatspreaders for power generation

Heatspreader for power generation

Contributing to Expansion of Offshore Wind Power Generation

The shift from coal or nuclear power generation to renewable energy is on progress worldwide.
Wind power generation, one type of the renewable energy, had to be located in a limited area in order to secure stable air volume and prevent the noise.
Then, to deploy the generator onto offshore is gaining attention.
Since there is no obstruction around it, air volume suitable for power generation can be stably obtained, and a number of generators can also be deployed at a close range.
For long-distance power transmission from the offshore to the land, direct current (DC), less loss at the time of power transmission, is considered ideal. But, to transform electrical energy to/from alternating current (AC), the substation loss was made unavoidably.
For this reason, in addition to high conversion efficiency, more compact and maintenance-free properties are required for the power devices due to offshore conditions.
In order to realize stable dissipation of heat generated by semiconductor chips that support our infrastructure for a long period of time, our highly reliable heat-dissipating plate (heatspreader) is ideal.

Applications Offshore wind power generation, etc.

Cu-Mo (Copper-Molybdenum)

Mo (Molybdenum)


Package Example

Base plate for power module

Base plate for power module

For power modules, in order to mitigate the difference of thermal expansion between IGBT chips and packaging materials, to have Molybdenum (Mo) chip carriers between them as thermal buffer plates is effective.
In addition, it can efficiently dissipate heat by jointing Cu-Mo plates to the packages.



Heatspraders for electric railways

eatsprader for electric railways

Contributing to Expansion of High-Speed Railway Network

Japan and Europe have led the world in the fields of high-speed railways such as bullet trains. But, in recent years, the networks are being applied rapidly in China and other Asian countries as well. The high-speed train converts the high-voltage current collected from the pantograph into a current suitable for motor drive by the main converter (converter and inverter). And an IGBT (insulated-gate bipolar transistor) is embedded in the control. Because they run at high speed, they must be compact and lightweight, and the heat generated from power devices is regarded as a problem. A.L.M.T. Corp. has molybdenum (Mo) -based heatspreaders that have heat dissipation properties and shape stabilities suitable for IGBT modules of electric railways.

Applications Inverters, etc.

Mg-SiC (Magnesium-Silicon Carbide)


Package Example

Base plate for power module

Base plate for power module

For power modules, which are represented by IGBT that control motors for high-speed trains, the heat dissipation to the increased power density is regarded as important.
Mg-SiC has a higher thermal conductivity than conventional material Al-SiC and less thermal deformation due to high-temperature operation for a long time.



Heatspreaders for industrial machinery

Heatspreader for industrial machinery

Contributing to the Precise Operation of Robots

High-output motors play a role in the operation of industrial machines such as robots and elevators, which are used in factories, offices, hospitals, and many other locations. To support their precise control, the motor is equipped with a high-performance power semiconductor module, and the efficient heat dissipation is the point for the stable operation. A.L.M.T. Corp. has heat-dissipating plates (heatspreaders) with high thermal conductivity and adjustable coefficient of thermal expansion for semiconductor chips.

Applications Industrial robots, Industrial equipment, etc.

Cu-W (Copper-Tungsten)

Cu-Mo (Copper-Molybdenum)

Ag-Diamond (Silver-Diamond)


Package Example

Thermal Buffer Plate

Thermal Buffer Plate

For heat dissipation of IGBT modules that control the current of motor drive, there is a method in which a metallic plate (such as Cu/ Al)] or a cooler is embedded.
Cu-Mo and Ag-Diamond are joined between the semiconductor chips and the metal plate to promote heat dissipation and function as a thermal-stress buffer material.