A.L.M.T. Corp.

Data summary

Detailed information of the various heat spreaders, including Ag-Diamond, CPC (Cu, Cu-Mo, Cu
3 layered material), Cu-Mo and Cu-W.
They have high thermal conductivity and coefficient of thermal expansion (CTE) close to
surrounding materials, which can contribute to improved package reliability.
This Cu-Mo and Cu-W technical papers contain content that has never been published before.