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A.L.M.T. Corp. will exhibit at 18th International Conference and Exhibition on Device Packaging, scheduled from 8-9, March, 2022. There we will introduce thermal solutions with heatspreaders.

18th International Conference and Exhibition on Device Packaging 2022

・Dates : 8-9, March (Conference:7-10, March)
・Place: WeKoPa Resort and Conference Center (CA, the U.S.)
・Booth#: 44
・Floor map: https://imaps.org/device_packaging_exhibits.php

・Registration: https://www.imaps.org/device_packaging_conference.php#register

◆Main Exhibits:

1. Ag-Diamond Heatspreader


2. Support Wafer for wafer bonding (Cu-Mo, Mo)



※ For further detailed information about the exhibition, please check the official website below.
https://www.imaps.org/device_packaging_conference.php