"18th International Conference and Exhibition on Device Packaging" was a successful event! Thank you for visiting our booth.
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A.L.M.T. Corp. will exhibit at 18th International Conference and Exhibition on Device Packaging, scheduled from 8-9, March, 2022. There we will introduce thermal solutions with heatspreaders. 18th International Conference and Exhibition on Device Packaging 2022 ･Dates : 8-9, March (Conference:7-10, March)･Place: WeKoPa Resort and Conference Center (CA, the U.S.) ･Booth#: 44 ･Floor map: https://imaps.org/device_packaging_exhibits.php ･Registration: https://www.imaps.org/device_packaging_conference.php#register ◆Main Exhibits： 1. Ag-Diamond Heat spreader  2. Support Wafer for wafer bonding (Cu-Mo, Mo)  ※ For further detailed information about the exhibition, please check the official website below. https://www.imaps.org/device_packaging_conference.php |