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Heatspreader
Dissipate the Heat of Your Semiconductor Device!
CPC™（Copper / Copper-Molybdenum / Copper）
- High thermal conductivity.- Coefficient of thermal expansion is adjustable and can be matched with surrounding materials.
- Laminated material "Cu / Cu-Mo / Cu".
- The Cu layer enhances the initial heat dissipation.
- High mass-productivity by rolling and pressing process.
Ag-Diamond（Silver-Diamond）
- High thermal conductivity, 600 W/(m･K).
- The thermal expansion is close to semiconductor chips and ceramic materials.
The information mentioned here is very limited.
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For Ceramic Package
CPC™ heatspreader
- By changing the content ratio of Cu, the coefficient of thermal expansion can be adjusted close toceramic frames.
So, it can relieve heat stress between a device and a substrate.
Ag-Diamond heatspreader
- Higher thermal conductivity, >600W/(m･K)- A coefficient of thermal expansion (CTE) is close to ceramic frames.
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For Metal Package
CPC™ heatspreader
- By changing the content ratio of Cu, the coefficient of thermal expansion can be adjusted close tometallic frames such as Kovar.
So, it can improve the reliability of package.
Ag-Diamond heatspreader
- Higher thermal conductivity, >600W/(m･K)- This material is used in the high-end applications.
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For Plastic Package
CPC™ heatspreader
- By reducing the content ratio of Cu, the coefficient of thermal expansion can be adjusted close tosemiconductor materials.
So, it can improve the reliability of devices.
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