A.L.M.T. Corp.

Heatspreaders for Semiconductor Devices

Data summary

Detailed information of the 2 heatspreaders for RF device packages, Ag-Diamond and
CPC™ (Cu, Cu-Mo, Cu 3 layered material).
They have high thermal conductivity and coefficient of thermal expansion (CTE) close to
surrounding materials, which can contribute to improved package reliability.

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