Demonstrates excellence in the primary grinding of as deposition and as-sliced wafers

A vitrified bond wheel having high grain holding power. The high porosity structure and the characteristic grain layer shape realize low grinding resistance and create a new grinding region.
"Nanomate" capable of creating a flatness below 1 μm with Φ300-mm silicon wafers enables grinding of brittle materials used for semiconductor and electronic parts that have been difficult to grind with conventional wheels.