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A.L.M.T. Corp.

Wheel for LT/LN wafer grinding
"Nanomate Premium"

Wheel for LT/LN wafer grinding </br>"Nanomate Premium"
Wheel for LT/LN wafer grinding </br>"Nanomate Premium"

Achieved low damage processing of LT (lithium tantalite) wafers

Because fragile LT wafers used as the SAW filter tend to get broken in processing, improving the surface roughness of machined surfaces is required.
"Nanomate Premium," having a high porosity abrasive layer with excellent durability of sharpness, provides low damage machining by the added body shape with a function of efficiently feeding to the grinding point.


  • The high porosity abrasive layer ensures long-lasting sharpness. The newly developed body shape allows uniform supply of grinding fluid to grinding points. High efficiency and high quality grinding is now possible.


Precision surface grinding of LT wafers


  • Semiconductor/electronics

Work Material

  • Semiconductor material

Processing Method

  • Surface grinding

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