Diamond/CBN Lapping plate"DPG Wheel MDP series"
A bonded grain lapping plate friendly to people and environment.
The "MDP Bond" series developed based on metal bond is employed in order to maintain good grain holding power and sharpness in bonded grain lapping. This plate solves problems (such as work environment and industrial wastes generation) in conventional lapping by use of loose abrasive grains and ensures high precision and high efficiency lapping.
Characteristics
- The amount of industrial wastes is reduced significantly. A clean work environment is realized. Lapping at a speed 5 to 100 times faster than lapping by use of loose abrasive grains is possible. The extended life of the plate and gear reduces materials and facility maintenance cost. The conventional processes of grinding and lapping can be integrated.
Applications
Diamond-MT bond wheels: high efficiency machining of ceramics, carbide, cermet and quartz; CBN-MT bond wheels: high efficiency machining of various ferrous materials, surface machining using cup type wheels and creep feed grinding, ideal for machining with the problem of sharpness of the wheel.
Industries
- Automobile/transportation equipment, optical/precision equipment, semiconductor/electronics, machine/tool, bearings, others
Work Material
- Ferrous material, carbide/cermet, glass/ceramics, magnetic material, others
Processing Method
- Surface grinding, cylindrical grinding, centerless grinding, double-ended surface grinding, and other grinding
Products in the same category
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