Nano polycrystalline diamond ultra precision cutting tool "BL-UPC"
Long life in mirror-cutting of cemented carbide and machining of fine shapes has been realized.
"SUMIDIA Binderless" is the new material that has been developed by Sumitomo Electric Industries, Ltd. Ultra fine particles in size of several tens of nanometers have been bonded firmly without the use of binding material, providing hardness that exceeds signal crystal diamond. Also there is no crystal anisotropy and cleavage. We have combined this material with our strong point, diamond precision polishing technology, to realize the tool that is very strong against chipping more than ever and long tool life. SUMIDIA is the registered trademark of Sumitomo Electric Industries, Ltd.
Characteristics
- The excellent chipping resistance and wear resistance that are not available from single crystal and polycrystalline diamond tools have been realized. This tool has the sharp and minute cutting edge equivalent to that of "UPC" (single crystal diamond). Since there is no anisotropy, machining is not affected by the crystal orientation.
Applications
Machining of cemented carbide glass lens molds, prism sheet large roll molds, light guide plate large molds, glass lenses and other high hardness and brittle materials
Industries
- Optical/precision equipment, semiconductor/electronics, others
Work Material
- 非鉄金属材料,超硬･サーメット,ガラス･セラミックス,半導体材料,樹脂･ゴム,その他
Processing Method
- 旋削加工,溝入れ･切断加工,その他
Products in the same category
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