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Heatspreaders for Power Devices

Heatspreaders for Power Devices

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Detailed information of the 4 heatspreaders for power devices, MAGSIC, Ag-Diamond, CPC (Cu, Cu-Mo, Cu 3 layered material) , and Cu-Mo. They can help produce higher performance and reliability from the modules, due to their high thermal conductivity, low thermal expansion and strong structural stability.


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