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Heatspreaders for Power Devices
Data summary
Detailed information of CPC (Cu, Cu-Mo, Cu 3 layered material), a heatspreader that has low
thermal expansion and high thermal conductivity. It is mainly used as a base plate for RF packages
and a spacer for automotive modules.
It is possible to improve the reliability of modules by matching the thermal expansion with
semiconductors and surrounding materials. It is also highly mass-producible by rolling and
stamping process.