Heatspreaders
Thermal Solutions for Your Devices!
- High thermal conductivity.
- The coefficient of thermal expansion (CTE) is adjustable to semiconductor chips.
- Excellent shape stability.
The information mentioned here is very limited.
Click the buttons below for detailed information or inquiry.
For Double Side Cooling (Spacers)
Cu-Mo (CPC TM) heatspreader
- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.
Ag-Diamond heatspreader
-High thermal conductivity, more than 600 W/(m･K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.
Click the buttons below for detailed information or inquiry.
For Base Plate
Cu-Mo / MAGSICTM(Mg-SiC) heatspreader
- High thermal conductivity.
- Excellent shape stability under high-temperature operation for a long time.
Click the buttons below for detailed information or inquiry.
For Thermal Buffer Plate
Cu-Mo / Mo heatspreader
- The CTE is close to semiconductors.
So, it can improve the reliability of devices.
Ag-Diamond heatspreader
-High thermal conductivity, more than 600 W/(m･K). (1.5 times of Cu)
Click the buttons below for detailed information or inquiry.