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Heatspreaders

Thermal Solutions for Your Devices!

heatspreader application     heatspreader application    
Diode lasers

 


- High thermal conductivity.
- The coefficient of thermal expansion (CTE) is adjustable to semiconductor chips.
- Excellent shape stability.

The information mentioned here is very limited. 
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For Double Side Cooling (Spacers)

Cu-Mo (CPC) heatspreader
- Adjustable CTE to match with semiconductor and packaging materials.
- Suitable for mass production; available with stamping process.

Ag-Diamond heatspreader
-High thermal conductivity, more than 600 W/(m・K). (1.5 times of Cu)
-Ni, Au and Ag plating are available.

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For Base Plate

Cu-Mo / Mg-SiC heatspreader
- High thermal conductivity.
- Excellent shape stability under high-temperature operation for a long time
.

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For Thermal Buffer Plate

Cu-Mo / Mo heatspreader
- The CTE is close to semiconductors.
   So, it can improve the reliability of devices.


Ag-Diamond heatspreader
-High thermal conductivity, more than 600 W/(m・K). (1.5 times of Cu)


Click the buttons below for detailed information or inquiry.