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Heatspreader
Dissipate the Heat of Your Semiconductor Device!
Our Heatspreaders are:
- High Thermal Conductivity!
- Excellent Shape Stability!
- Adjustable CTE to Device and Packaging Materials!
The information mentioned here is very limited.
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For Ceramic Package
Cu-W / Cu-Mo (CPC) heatspreader
- A coefficient of thermal expansion (CTE) is close to ceramic frames.
So, it can relieve heat stress between a device and a substrate.
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For Metal Package
Cu-W / Cu-Mo heatspreader
- CTE is close to metallic frames such as Kovar.
So, it can improve the reliability of devices.
Ag-Diamond heatspreader
-Higher thermal conductivity, >600 W/(m･K).
Click the buttons below for detailed information or inquiry.