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Heatspreader

Dissipate the Heat of Your Semiconductor Device!

heatspreader application     heatspreader application    
Diode lasers

 

Our Heatspreaders are:

- High Thermal Conductivity!
- Excellent Shape Stability!
- Adjustable CTE to Device and Packaging Materials!

The information mentioned here is very limited. 
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For Ceramic Package


Cu-W / Cu-Mo (CPC) heatspreader
- A coefficient of thermal expansion (CTE) is close to ceramic frames.
  So, it can relieve heat stress between a device and a substrate.

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For Metal Package


Cu-W / Cu-Mo heatspreader
- CTE is close to metallic frames such as Kovar.
   So, it can improve the reliability of devices.


Ag-Diamond heatspreader
-Higher thermal conductivity, >600 W/(m・K).


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For Plastic Package


Cu-Mo (CPC) heatspreader
- CTE is close to semiconductor materials.
   So, it can improve the reliability of devices.


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