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The MT Bond is new metal bond developed in pursuit of ultimate sharpness. This wheel is ideal for operations that require the sharpness of the wheel to be maintained for a long time such as surface grinding by use of a cup wheel and creep feed grinding.
| Applications | Diamond-MT bond wheels: high efficiency machining of ceramics, carbide, cermet and quartz; CBN-MT bond wheels: high efficiency machining of various ferrous materials, surface machining using cup type wheels and creep feed grinding, ideal for machining with the problem of sharpness of the wheel |
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Long-lasting sharpness and high dressing performance improve the grinding efficiency significantly.
| Applications | Mass production of double-ended surface grinding of magnetic material parts and ceramics parts etc. |
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These wheels can meet various cutting requirements. They exhibit excellent performance in cutting various materials.
| Applications | Precision cutting of various ceramics, quartz, glass, ferrite, etc. |
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High quality is achieved to meet various beveling requirements.
| Applications | Beveling of glass, ceramic and magnetic material parts |
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A vitrified bond wheel having high grain holding power. The high porosity structure and the characteristic grain layer shape realize low grinding resistance and create a new grinding region.
| Applications | Primary grinding of as deposition and as-sliced wafers, etc. |
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This wheel demonstrates excellence in reducing damaged layers and strain layers during grinding of brittle materials such as reducing polishing of 300-mm silicon wafers and minimizing cracking of thin device wafers.
| Applications | Ultra-precision surface grinding of various semiconductor wafers |
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Continuous grinding of single crystal SiC wafers that are difficult to grind with other wheels is now possible. Grinding can be performed at the same feed rate as for Si wafers and ultra-smooth surfaces can be produced.
| Applications | Ultra-precision surface grinding of various semiconductor wafers |
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Brittle LT wafers used for SAW filters can be ground with low damage and high quality.
| Applications | Precision surface grinding of LT wafers |
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The long-lasting good sharpness and high dressing performance/wear resistance improve the grinding efficiency significantly.
| Applications | Mass-production double-ended surface grinding including pump parts for air-conditioner, oil pump parts for cars, engine parts of cars, magnetic material parts, and ceramics parts |
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These wheels can meet various cutting requirements. They exhibit excellent performance in cutting various materials.
| Applications | Precision cutting of various ceramics, quartz, glass, ferrite, etc. |
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This wheel offers excellent shape retention performance and good sharpness in form grinding of magnetic materials. Form grinding can be performed efficiently since truing/dressing on a machine is not required.
| Applications | High efficient total shape processing of magnetic material, carbide, ceramics, etc. |
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This wheel can meet various cutting requirements. It demonstrates excellent cutting performance in cutting various materials. In particular, it improves the cutting efficiency significantly.
| Applications | Cutting of various ceramics, glass, ferrite, composite material, etc. |
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A thin blade wheel of all-grain layer type realized by our original electroforming technology to enable high precision cutting and fine grooving accurately.
| Applications | Precision cutting and grooving of various materials |
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A lineup of cutting tools for various nano/micro-forming. The cutting edge polished accurately and measured carefully by our original technologies can machine workpieces in the order of nanometer to realize high precision micro-shape machining
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This tool has a cutting edge with high precision profile within a wide working angle range to realize excellent shape machining. This tool exhibits excellent performance in ultra-precision machining of spherical and aspherical surfaces.
| Applications | Molds of pickup lenses for CD, DVD and Blu-ray, molds of lenses for digital cameras,, molds of camera lenses for cell phones, PC and tablets, infrared lenses, spherical/aspherical mirrors for laser/X-rays, various spherical and aspherical lenses, profile machining with ultra-precision machine |
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A tool ideal for high efficiency and ultra-precision cutting of planes and cylinders. An ultra-precision cutting tool that significantly reduces or eliminates the time for running-in.
| Applications | Laser reflection mirrors, polygon mirrors, copier photosensitive drums, plane and cylindrical mirror finishing |
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Ideal for ultra fine grooving of Fresnel lens, etc. The shape of cutting edge tips is guaranteed in the order of submicron.
| Applications | Molds of LCD light guide plates, Fresnel lens molds, optical sheet molds, various grating molds, other fine grooving |
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Highly precise ultra fine grooving not achievable by the photolithography and ion beam processing can be realized.
| Applications | Holographic grating molds, linear fine grooving, molds that require ultra fine grooving, optical sheet molds |
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Free curve ultra fine grooving of the world's smallest class as small as groove width 50 μｍ is possible.
| Applications | Holographic grating molds, free curve ultra fine grooving, LCD light guide plate molds, micromachine parts |
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The world' smallest class "R30 μm" and the world's highest accuracy of profile 50 nm have been realized.
| Applications | Micro lens arrays, free curve sub-millimeter lenses, LCD light guide plate molds, micro parts machining |
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