A.L.M.T. Corp.

Heat spreaders need to quickly dissipate the heat generated by semiconductor operation to the radiator plate and other such places. They can be joined using various methods such as Ag brazing, Pb-free soldering, Au soldering, and Ag nano-paste. For this purpose, we can employ techniques such as Ni electro-plating, Ni-P electro-less plating, and electro-gold plating. We also perform plating that adheres well to W and Mo, despite their poor plating properties, thus ensuring excellent heat radiation.

We offer pre-soldered* products that simplify the production process of bonding power modular semiconductors and heat spreaders. These can improve bonding reliability, increase yield rates, and simplify the management of parts purchases.
(*These are heat spreaders that come with solder already applied)

We use our original deposition technology to form an Au/Sn eutectic alloy solder layer on heat spreaders, which is suitable for bonding semiconductor devices. The composition ratio of Au and Sn can be adjusted to control the bonding characteristics. By forming the Au/Sn layer on the surface, there is potential to improve workability and yield rates when bonding semiconductor devices.

We can form fine patterns of Ti, Ni, Cr, Pt, Cu and Au using photosensitive resist on the AlN substrate. The standard line and space (L/S) is 50 μm/50 μm, and we can accommodate sizes down to 30 μm/30 μm.

Our advanced machinery and technical experts, who possess in-depth knowledge of material properties, work together to produce complex shapes with a high degree of precision, up to the order of microns.
We have an array of machines and equipment capable of meeting customer requirements for both small and large-scale production within short delivery times.

We can create sharp edges on products made from Cu-W, Cu-Diamond, CVD diamond, and Sumicrystal. The standard edge radius is typically 30 μm or less, but we can achieve an edge radius of 20 μm or less based on the product specifications.

In this assembly process, the IGBT device is joined with an insulating substrate and large Cu-Mo heat spreader from top to bottom, with a water-cooled radiator installed beneath. By applying grease and fastening the large heat spreader, it ensures tight contact with the radiator to efficiently dissipate heat. The major advantage of this system is its ease of assembly and replacement.

To further improve heat dissipation, a system has developed that directly attaches pins to the bottom surface of the heat dissipation plate, integrating this with the water-cooled radiator. This system utilizes a large Cu-Mo heat spreader equipped with pins.

Instead of a large Cu-Mo heat spreader, this system places a Cu-Mo heat spreader directly under the chips to ensure heat dissipation and thermal stress reduction.

To achieve even higher heat dissipation, a double-sided heat dissipation system has been developed that includes a heat dissipation plate on the top surface of the inverter. Three flat-shaped heat spreaders are used to sandwich the chips from both above and below.

MAGSIC, which is manufactured from Mg ingot and SiC powder using our unique powder filling and infiltration technologies, is highly suitable for mass producing large-scale products. The standard MAGSIC material has a thermal expansion coefficient of 7.0 ppm and a thermal conductivity of 230 W/(m・K).

Ag, which has a higher thermal conductivity than Cu, is the metal with the highest thermal conductivity. Ag and diamond powder are mixed and sintered using our proprietary technology to successfully produce a new material with a thermal conductivity of 600 W or more. This new material, which can be produced in larger dimensions than conventional diamond materials, serves as a diamond heat spreader. It can be used in a variety of applications including PKG base plates for high-output devices and heat dissipation substrates for large devices.

CPC is a composite material that features a laminated structure, with Cu layers sandwiching the Cu-Mo composite material. The thermal conductivity and linear expansion coefficient of this material can be adjusted by altering the composition of the core material, Cu-Mo, and the ratio of lamination. In addition, because both surfaces are composed of Cu, it exhibits excellent initial heat radiation.